MicroFabSolutions provides expert services in the field of microtechnologies

We have access to a high quality microfabrication facilityIt is composed of two clean rooms, microsystem integration and testing laboratories with a wide variety of capabilities at our disposal.

The microfabrication capabilities are:

  • Metal Magnetron sputtering (Al, Al1%Si, Ti, TiN)
  • Diffusion furnaces (dry and wet oxidation, boron and phosphourus diffusion, N2 annealing)
  • LPCVD (TEOS, poly-Si, Silicon Nitride, BPSG)
  • PECVD (Silicon oxide, Silicon Nitride, Amorphous Silicon)
  • Projection lithography: CD 2um, accuracy 1um
  • Stepping lithography: CD 350nm, accuracy 75nm
  • Ion Implantation (B+, BF2 +, P+, As+, Ar+,B++, P++)
  • PVD metallization (Gold, Chrome, Silver, Titanium, Platinum, Aluminum, Palladium..)
  • Electroplating (gold, copper)
  • Dry etching
  • Wet etching

The measurement capabilities are:

  • Field Effect SEM
  • Ellipsometry
  • Inspection μScopes
  • Non contact profiling
  • Contact profiling
  • 4 point probe
  • R. I. Measurement 

 The microsystem integration capabilities are:

  • Wafer bonding (anodic, Au-Si eutectic, adhesive bonding)
  • Screen Printer
  • Wafer Dicing
  • Assembly Station