Coated Substrate

Microfabsolutions provides different coating service for wafers, chips, slides substrates.

Thin film deposition via sputtering or evaporation technique are available on different types of substrates.

COATING AVAILABLE                         Request a Quote

METAL LAYER ADHESION LAYER TECHNIQUE
Gold  –  Au Ti or Cr e-beam evaporation
Silver  – Ag Ti e-beam evaporation
Platinum – Pt Ti e-beam evaporation
Aluminum – Al or Al1%Si sputtering
Titanium – Ti sputtering
Titanium Nitride – TiN reactive sputtering

SUBSTRATES AVAILABLE                                Request a Quote

WAFER 150mm diameter 500 – 650 μm  Silicon, Glass or Quartz
CHIP 10 mm x 10 mm 500 – 650 μm  Silicon, Glass or Quartz
SLIDE  1′ x 3” 500 – 650 μm  Silicon, Glass or Quartz
Silicon Wafer (Prime Grade) Glass wafer Quartz Wafer
Prime Grade

150 mm diameter
Type/Dopant: P/Boron
Orientation: <100>
Resistivity: 1-50 ohm-cm
Front Surface: Polished
Back Surface: Etched

150 mm diameter

Boroflat

150 mm diameter 

Looking for custom substrates or coatings?

Please fill out our Request a Quote form