Microfabsolutions provides different coating service for wafers, chips, slides substrates.
Thin film deposition via sputtering or evaporation technique are available on different types of substrates.
COATING AVAILABLE
| METAL LAYER | ADHESION LAYER | TECHNIQUE |
| Gold – Au | Ti or Cr | e-beam evaporation |
| Silver – Ag | Ti | e-beam evaporation |
| Platinum – Pt | Ti | e-beam evaporation |
| Aluminum – Al or Al1%Si | – | sputtering |
| Titanium – Ti | – | sputtering |
| Titanium Nitride – TiN | – | reactive sputtering |
SUBSTRATES AVAILABLE
| WAFER | 150mm diameter | 500 – 650 μm | Silicon, Glass or Quartz |
| CHIP | 10 mm x 10 mm | 500 – 650 μm | Silicon, Glass or Quartz |
| SLIDE | 1′ x 3” | 500 – 650 μm | Silicon, Glass or Quartz |
| Silicon Wafer (Prime Grade) | Glass wafer | Quartz Wafer |
| Prime Grade
150 mm diameter |
150 mm diameter
Boroflat |
150 mm diameter |
Looking for custom substrates or coatings?
Registro imprese C.C.I.A.A. Trento
C.f. e P.IVA: IT-02382740229 | R.E.A. TN 220431
Cap.Soc. 10.500E i.v.